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激光精确微加工(英文影印版)
[2015-06-09]


索书号 O4/Z698/v.51

1 Process Control in Laser Material Processing for the Micro and Nanometer Scale Domains
1.1 Introduction
1.2 Laser Processing  
1.2.1 Laser Wavelength  
1.2.2 Laser Power
1.2.3 Laser Dose
1.2.4 Laser Beam  
1.2.5 Laser Pulse Temporal Profile  
1.2.6 Pattern Generation  
1.3 Possible Steps Forward  
1.4 Conclusions
References  
2 Theory and Simulation of Laser Ablation - from Basic Mechanisms to Applications.  
2.1 Introduction  
2.2 Basic Physics
2.2.1 Light-Matter Interaction  
2.2.2 Material Removal from the Target:The Basics of Ablation
2.3 Ablation in the Thermal Regime
2.3.1 Thermodynamics  
2.3.2 ConventionalWisdom: Early Theories
2.3.3 A New Understanding  
2.3.4 Computer Models
2.3.5 The Femtosecond Regime  
2.3.6 Picosecond Pulses and Beyond
2.3.7 Molecular Solids  
2.4 Materials Processing  
2.4.1 Nanoparticle Production in Solvents  
2.4.2 Damages and Heat Affected Zones
2.5 Conclusions and Perspectives  
References
3 Laser Devices and Optical Systems for Laser Precision Microfabrication  
3.1 Introduction  
3.2 Laser Devices  
3.2.1 Various Laser Devices from Deep UV and Mid-IR Spectral Region  
3.2.2 Diode-Pumped High-Brightness Continuous Wave Solid-State Lasers  
3.2.3 Q-Switching and Cavity Dumping  
3.2.4 Picosecond and Femtosecond, Ultrafast Pulsed Laser Oscillators and Amplifiers
3.3 Optical Systems
3.3.1 Optical Components for Modification and Control of Laser Beams  
3.3.2 Optical Systems for Beam Shape Transformation  
3.3.3 Galvanometer-Based Optical Scanners  
3.3.4 Spatial Light Modulators  
3.3.5 Nonlinear-Optical Systems for Harmonic Generation
3.3.6 Optical Systems for Beam Characterization and ProcessMonitoring  
3.4 Summary
References
4 Fundamentals of Laser-Material Interaction and Application to Multiscale Surface Modification
4.1 Introduction  
4.2 Fundamentals of Laser Surface Processing
4.2.1 Light Propagation in Materials
4.2.2 Energy Absorption Mechanisms .
4.2.3 The Heat Equation
4.2.4 Material Response
4.3 Laser Surface Processing Applications  
4.4 Case Study I: Surface Texturing for Enhanced Optical Properties
4.5 Case Study II: Surface Texturing for Enhanced Biological Interactions
4.6 Conclusions
References  
5 Temporal Pulse Tailoring in Ultrafast Laser Manufacturing Technologies  
5.1 Introduction  
5.2 Fundamental and Technical Aspects of Pulse Shaping .
5.2.1 Basics of Ultrashort Laser Pulses
5.2.2 Frequency Domain Manipulation(Mathematical Formalism)
5.2.3 Analytical Phase Functions Relevant to Material Processing
5.2.4 Pulse Shaping in the Spatial Domain
5.2.5 Experimental Implementations for Temporal Pulse Shaping
5.2.6 Optimization Strategies
5.3 Material Interaction with Temporally Shaped Pulses  
5.3.1 Control of Laser-Induced Primary Excitation Events  
5.3.2 Engineered Thermodynamic Phase-Space Trajectories  
5.3.3 Refractive Index Engineering by Temporally Tailored Pulses
5.4 Conclusion and Perspectives
References  
6 Laser Nanosurgery,Manipulation, and Transportation of Cells and Tissues  
6.1 Introduction  
6.2 Laser Direct Surgery  
6.2.1 Nanosurgery with a Focused Laser Beam in the Ultraviolet and Visible Region.
6.2.2 Femtosecond Laser Surgery
6.3 Nanoparticles and Chromophore-Assisted Manipulation and Processing.
6.3.1 Chromophore-Assisted Laser Inactivation  
6.3.2 Plasmonic Nanosurgery
6.4 Laser Manipulation and Transport of Cells and Tissues  
6.4.1 Optical Tweezers
6.4.2 Laser Transport of Cells  
6.5 Application of Laser-Induced ShockWaves and Mechanical Waves
6.5.1 Targeted Gene Transfection by Laser-Induced Mechanical Waves  
6.5.2 Femtosecond Laser-Induced ShockWave in Liquid
6.6 Laser-Induced Stimulation  
6.7 Fabrication of Microfluidic Channels and Scaffolds
6.8 Summary and Conclusions  
References  
7 Laser Synthesis of Nanomaterials  
7.1 Introduction
7.2 General Principles of Laser Based Synthesis of Nanomaterials  
7.2.1 Nanosecond Pulsed Laser Ablation
7.2.2 Ultrafast Laser Ablation  
7.3 Synthesis of Nanomaterials Based on Laser Ablation of a Bulk Target  
7.4 Laser Ablation in Vacuum/Gas Environment .
7.5 Laser Ablation in Liquids: Formation of Colloidal Nanoparticles
7.5.1 Ablation Mechanisms  
7.5.2 Effect of Laser Parameters
7.5.3 Effect of Stabilizing Agents  
7.5.4 Process Model
7.6 Synthesis of Nanomaterials Based on Laser Interaction with Micro/Nanomaterials  
7.7 Conclusions and Perspective  
References  
8 Ultrafast Laser Micro- and Nanostructuring
8.1 Introduction
8.2 Theoretical Background  
8.2.1 Dielectrics  
8.2.2 Metals  
8.2.3 Thermodynamic Approach  
8.3 Recent Results  
8.3.1 Top-Down Approaches to Nanostructures  
8.3.2 Thin Film Ablation  
8.3.3 Incubation Phenomena  
8.3.4 Bottom-Up Approaches to Nanostructures  
8.3.5 Biogenetic Materials
8.4 Outlook 6
8.4.1 Recent Instrumental Developments  
8.4.2 Nanostructuring in the Nearfield
8.5 Summary
References  
9 3D Fabrication of Embedded Microcomponents  
9.1 Introduction
9.2 Principles of Internal Processing
9.3 Refractive Index Modification.
9.3.1 Advantages of Femtosecond Laser in Photonic Device Fabrication  
9.3.2 Optical Waveguide Writing  
9.3.3 Fabrication of Photonic Devices.  
9.3.4 Fabrication of Fiber Bragg Gratings (FBGs)  
9.4 Formation of 3D Hollow Microstructures  
9.4.1 Direct Ablation in Water
9.4.2 Internal Modification Followed by Wet Etching
9.5 3D Integration of Microcomponents  
9.6 Beam Shaping for Fabrication of 3D Microcomponents  
9.7 Summary  
References  
10 Micromachining and Patterning  
Jürgen Ihlemann
10.1 Introduction  
10.2 Direct Writing  
10.3 Micro Fluidics.
10.4 Gratings  
10.5 Diffractive Optical Elements  
10.6 Micro Lenses/Lens Arrays  
10.7 Patterning of Layers  
10.8 Dielectric Masks  
10.9 Two Step Processing of Layers: Ablation C Oxidation  
10.10 Summary and Outlook  
References  
11 Laser Transfer Techniques for DigitalMicrofabrication  
11.1 Introduction  
11.2 Lasers in Digital Microfabrication  
11.3 Origins of Laser Forward Transfer  
11.3.1 Early Work in Laser-Induced Forward Transfer  
11.3.2 Transferring Metals and Other Materials with LIFT  
11.3.3 Fundamental Limitations of the Basic LIFT Approach  
11.4 Evolution of Laser Forward Transfer Techniques  
11.4.1 The Role of the Donor Substrate
11.4.2 Development of Multilayered Ribbons and Dynamic Release Layers  
11.4.3 LIFT with Ultra-Short Laser Pulses
11.4.4 Laser Transfer of Composite or Matrix-Based Materials  
11.4.5 Laser Transfer of Rheological Systems
11.4.6 Jetting Effects
11.4.7 Laser Transfer of Entire Devices  
11.4.8 Recent Variations of the Basic LIFT Process  
11.5 Applications  
11.5.1 Microelectronics
11.5.2 Sensor and Micropower Generation Devices
11.5.3 Biomaterials  
11.5.4 Embedded Electronic Circuits .
11.6 The Future of Laser-Based Digital Microfabrication  
11.6.1 Laser Forward Transfer vs. Other Digital Microfabrication Processes
11.7 Summary  
References  
12 Hybrid Laser Processing of Transparent Materials
12.1 Introduction
12.2 Multiwavelength Excitation Process  
12.2.1 Principle of Multiwavelength Excitation Process
12.2.2 Microfabrication of Transparent Materials
by Multiwavelength Excitation Process
12.3 Media Assisted Process  
12.3.1 Classification of Media Assisted Processes
12.3.2 LIPAA Process  
12.3.3 LIBWE Process  
12.4 Conclusions  
References
13 Drilling, Cutting,Welding, Marking and Microforming  
13.1 Parameter Regimes
13.1.1 Pulse Duration
13.1.2 Wavelength  
13.1.3 Beam Quality
13.1.4 Output Power  
13.2 Drilling  
13.2.1 Laser Drilling Without Relative Movement Between Laser Spot and Workpiece.
13.2.2 Laser Drilling with Relative Movement Between Laser Spot andWorkpiece
13.2.3 Trepanning Head  
13.2.4 Further Trends and Outlook  
13.3 Cutting
13.3.1 Melt Cutting
13.3.2 Laser Ablation Cutting  
13.3.3 Laser Scribing
13.3.4 Laser Induced Stress Cutting
13.4 Microjoining  
13.4.1 Welding  
13.4.2 Soldering  
13.5 Marking
13.5.1 Laser Marking by Material Removal or Addition  
13.5.2 Laser Marking by Material Modification  
13.6 Microforming  
13.7 Summary  
References  
Index